Characteristics	Specifications			Test methods
DC resistance (JIS-C-5202 5.1)	J (+5%)			Resistance value test at room temperature 25°C
Temperature coefficient (JIS-C-5202 5.2)	+350 PPM/°C
				R2-R1	*106 (PPM/°C)
				R1(T2-T1)
				R1: Resistance value at room temperature (T1)
				R2: Resistance value at room temperature +100°C (T2)
Load life in humidity (JIS-C-5202 7.9)	Resistance change rate is  +(5% +0.05Ω) max. with no evidence of mechanical damage.			Resistance change after 1000Hrs (1.5Hrs on, 0.5Hrs off) At rated voltage in a humidity chamber controlled at 40+2°C and 90-95% relative humidity.
Load life (JIS-C-5202 7.10)	Resistance change rate is  +(5% +0.05Ω)max. with no evidence of mechanical damage.			Resistance change after 1000Hrs operating at rated voltage with duty cycle of 1.5Hrs on 0.5Hrs off at 70°C + 2°C.
Short time over load (JIS-C-5202 5.5)	+(1% + 0.05Ω)			Resistance change after the application of a potential of 2.5 time rated voltage for 5 second.
Pulse overload (JIS-C-5202 5.8)	Resistance change rate is +(2% + 0.05Ω) max. with no evidence of mechnical damage.			Resistance change after 10000 cycles (1 seconds on. 25 seconds off) at 4 time rated voltage(AC)
Humidity (JIS-C-5202 7.4)	Resistance change rate is +(2%+0.05Ω)Max. with no evidence of mechanical damage.			Resistance change after 240hrs exposure in a humidity test chamber controlled at 40+2°C and 90-95% relative humidity.
Resistance to soldering heat (JIS-C-5202 6.4)	Resistance change rate is  +(1%+0.05Ω)Max. with no evidence of mechanical damage.			Dipping both side of resistor copper wire 3.2mm to 4.8mm according to the test method below:
				Temperature		DIP time
				350°C+10°C		3.5+0.5sec.
				260°C+5°C		10+1.0sec.
Solderability (JIS-C-5202 6.5)	95% coverage minimum			Test temperature of solder:
				235+5°C
				Dwell time in solder: 3+0.5 sec.